Tenders

1
Auction Notice for selling scrap items currently laid down at the STPI-Guwahati office premises.
Tender Reference No.:
Auction Notice
Tender Publishing Date:
Tender Closing Date:
Bid Submission Date:
BID SUBMISSION END DATE :

नीलामी का स्थान
Auction Venue:
Software Technology parks of India, Guwahati. Near L.G.B.I Airport Road, Borjhar-Guwahati.

नीलामी की तारीख
Auction date:
14.11.2024

नीलामी की जाने वाली रद्दी संपचियााँ
Scrap assets to be auctioned
Iron Scrapping / sale of Movable Assets

2
RFP for SELECTION OF FINANCIAL INSTITUTION FOR VALUATION AND MONITORING OF START-UPS UNDER OctaNE
Tender Reference No.:
STPI/GWH/ADM/GENA/MISC/2023-2024/8 dated 10-06-2024
Tender Publishing Date:
Tender Closing Date:
Pre-bid Meeting Date:
Technical Presentations Date:
Bid Submission Date:
BID SUBMISSION END DATE :
Technical Bid Opening Date:
3
Empanelment of Professional Expert Agencies for Start-up Support Services at STPI
Tender Reference No.:
STPI/HQ/PDC/07/2018-19/122
Tender Publishing Date:
Pre-bid Meeting Date:
Bid Submission Date:
BID SUBMISSION END DATE :
Bid Opening Date:

The bid has to be submitted online on URL https://eprocure.gov.in/eprocure/app along with the standard formats prescribed in the Tender documents.

4
SELECTION OF MSP FOR SETTING UP AND MANAGING GOVERNMENT COMMUNITY CLOUD (GCC) & HYBRID CLOUD IN REVENUE SHARE MODEL
Tender Reference No.:
STPI/HQ/TECH/DC/CLOS/2022-2023/1
Tender Publishing Date:
Pre-bid Meeting Date:
Bid Submission Date:
BID SUBMISSION END DATE :
Bid Opening Date:

Tender EMD (Earnest money deposit)

INR 1,00,00,000/- (Rupees One Crore Only)

Bid Status : Cancelled

STPI invites online bids (Technical & Commercial) from eligible bidders which shall be valid for a minimum period of 180 days from the date of bid submission for “RFP for Selection of MSP for setting up and Managing Government Community Cloud (GCC) & Hybrid Cloud in Revenue Share Model”.

Tender Mode: Online (e-Tender at https://eprocure.gov.in/app)

Bid submission & Bid Opening dates have been extended, refer to the corrigendum for more details.

Corrigendum for date extension

Reponses to the queries after publishing bid corrigendum

5
SELECTION OF MSP FOR SETTING UP AND MANAGING GOVERNMENT COMMUNITY CLOUD (GCC) & HYBRID CLOUD IN REVENUE SHARE MODEL
Tender Reference No.:
STPI/HQ/TECH/DC/CLOS/2022-2023/1
Tender Publishing Date:
Pre-bid Meeting Date:
Bid Submission Date:
BID SUBMISSION END DATE :
Bid Opening Date:

Tender EMD (Earnest money deposit)

INR 100,00,000/- (Rupees One Crore Only) valid during the Bid Validity Period and an additional 30 days post-Bid Validity Period

STPI invites online bids (Technical & Commercial) from eligible bidders which shall be valid for a minimum period of 180 days from the date of bid submission for “RFP for Selection of MSP for setting up and Managing Government Community Cloud (GCC) & Hybrid Cloud in Revenue Share Model”.

Pre Bid Meeting Link: https://stpi.webex.com/stpi/j.php?MTID=m1a31e9e89739ce19aea3c0f6d4931d16
Meeting number: 2516 388 6326 

Tender Mode: Online (eProcure)

Pre-bid Queries Response Clarification : Click Here

6
Appointment of Consultant for segregation of Books of Accounts for the FY 2022-2023 & FY 2023-2024
Tender Reference No.:
GEM/2023/B/4156866
Tender Publishing Date:
Pre-bid Meeting Date:
Bid Submission Date:
BID SUBMISSION END DATE :
Bid Opening Date:

Pre-Bid Meeting: 06 Nov 2023 @ 11:00 AM
Venue: STPI, Plate-B, 1st Floor, Block-1, East Kidwai Nagar, New Delhi - 110023

7
Providing PVC Paneling, Partition and Fixing of Non-Transparent Glass in Partition at STPI-GUWAHATI CENTRE.
Tender Reference No.:
STPIGHY/COE/NIT/FY24-25/01 Dated 29.04.2024
Tender Publishing Date:
Tender Closing Date:
TECHNICAL BID SUBMISSION START DATE:
BID SUBMISSION END DATE :
Bid Opening Date:

Providing PVC Paneling, Partition and Fixing of Non-Transparent Glass in Partition at STPI-GUWAHATI CENTRE.

8
Selection of Financial Institution for Valuation and Monitoring of start-ups under OctaNE.
Tender Reference No.:
STPI/GWH/ADM/GENA/MISC/2023-2024/8 dated 27-04-2024
Tender Publishing Date:
Tender Closing Date:
Pre-bid Meeting Date:
Bid Submission Date:
BID SUBMISSION END DATE :
Bid Opening Date:
9
Empanelment of System Integrators for Solution Design, Supply, Configuration and Maintenance of IT Systems
Tender Reference No.:
STPI/HQ/TECH/PMC/PROJ/24-25/1
Tender Publishing Date:
Pre-bid Meeting Date:
Bid Submission Date:
BID SUBMISSION END DATE :
Bid Opening Date:

The pre-bid meeting is scheduled offline and online (through WebEx) on 20th August 2024 (1100hrs) at STPI-HQ. The virtual link details are as below:
Meeting link: https://stpi.webex.com/stpi/j.php?MTID=m5b77bc7b38d9a53d1008be55ec0ce128
Meeting number: 2516 870 7165

10
Empanelment of Software Development Agencies (SDAs)
Tender Reference No.:
STPI/HQ/TECH/NSIG/MISC/24-25/2
Tender Publishing Date:
Pre-bid Meeting Date:
Bid Submission Date:
BID SUBMISSION END DATE :
Bid Opening Date:

Software Technology Parks of India (STPI) invites Empanelment bid from reputed vendors for the Empanelment of Software Development Agencies (SDAs) as mentioned in the EoI document.

CPP Tender ID: 2024_DIT_823945_1

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